Top 10 EPE Bonding Machine Manufacturers

January 30, 2024

The EPE Bonding Machine industry is witnessing several trends. Increasing demand for eco-friendly packaging solutions, automation in manufacturing processes, and integration of advanced technologies like AI and IoT are driving the growth. Moreover, the rising need for efficient energy utilization and cost-effective production methods are shaping the industry's future.

ASM Pacific Technology
Kulicke & Soffa
Hesse Mechatronics
Orthodyne Electronics
K&S Bondjet
Palomar Technologies
West Bond
Laizhou Jinlida Machinery Co.,Ltd
Shinkawa Electric Co., Ltd.
F&K Delvotec Bondtechnik

ASM Pacific Technology

Establishment time : ASM Pacific Technology was established on June 28, 1975.

website : www.asmpacific.com

Main Product : Their main products include semiconductor assembly and packaging equipment, materials, and solutions.

Company Profile

ASM Pacific Technology is a leading provider of advanced packaging and assembly solutions for the semiconductor industry, offering innovative technologies and services to meet customer requirements.

Kulicke & Soffa

Establishment time : 1951

website : www.kns.com

Main Product : Semiconductor assembly equipment, packaging solutions, and advanced packaging materials.

Company Profile

Kulicke & Soffa is a leading provider of semiconductor assembly equipment and packaging solutions. With a history dating back to 1951, the company has established itself as a key player in the industry. Their product portfolio includes advanced packaging materials, wire bonders, and packaging solutions. With a global presence, Kulicke & Soffa serves customers in various markets worldwide, including Asia, Europe, and North America. The company operates in a highly competitive market, facing competition from other major players in the semiconductor assembly equipment industry.

Hesse Mechatronics

Establishment time : Hesse Mechatronics was established on January 1, 2005.

website : www.hesse-mechatronics.com

Main Product : The main products offered by Hesse Mechatronics include industrial automation systems, robotic solutions, and mechatronic components.

Company Profile

Hesse Mechatronics is a leading provider of innovative mechatronic solutions, catering to the automation needs of various industries.

Orthodyne Electronics

Establishment time : Orthodyne Electronics was established on January 1, 1959.

website : www.orthodyne.com

Main Product : Orthodyne Electronics specializes in the manufacturing and distribution of wire bonding equipment, die bonders, and related accessories.

Company Profile

Orthodyne Electronics is a reputable company known for its high-quality products and innovative solutions in the field of wire bonding.

K&S Bondjet

Establishment time : 1992

website : www.knsbondjet.com

Main Product : Bonding machines and equipment

Company Profile

K&S Bondjet is a leading manufacturer of bonding machines and equipment. Established in 1992, the company has grown to become a medium-sized player in the industry. With a strong market presence and a global reach, K&S Bondjet offers a wide range of bonding solutions to various industries. For more information, please visit their website at www.knsbondjet.com.

Palomar Technologies

Establishment time : Palomar Technologies was established on March 14, 1973.

website : www.palomartechnologies.com

Main Product : Palomar Technologies specializes in the development and manufacturing of advanced packaging and assembly solutions for the microelectronics industry.

Company Profile

Palomar Technologies is a leading provider of innovative solutions for microelectronic packaging and assembly, catering to a global customer base.

West Bond

Establishment time : West Bond was established in 1956.

website : www.westbond.com

Main Product : West Bond specializes in the manufacturing of wire bonders, die bonders, and automated microelectronics assembly systems.

Company Profile

West Bond is a leading provider of wire and die bonding equipment, offering innovative solutions for microelectronics assembly.

Laizhou Jinlida Machinery Co.,Ltd

Establishment time : 2003

website : www.jldepe.com

Main Product : EPE Foam Machine,Extruding Laminating Machine,Auto Cutting Machine,EPE Bonding Machine,EPE Recycling Machine,Baby Mat Making Machines

Company Profile

Laizhou Jinlida Machinery,was established in 2003,is one high-tech private enterprises assemblly the research and development, manufacturing, sales and service, has many years engaged in the mechanical design and development professionals and advanced processing equipment. And obtained a number of patents, has been in the leading position in the industry, and long-term cooperation and communication with South Korea foaming machine factory, update the foaming process, so that our customers in the peer competition to occupy an absolute advantage.
Our machines sold to more than 40 countries around the world, with a strong after-sales service and technical support team. To provide customers with the best quality service.

Shinkawa Electric Co., Ltd.

Establishment time : Shinkawa Electric Co., Ltd. was established on April 1, 1946.

website : www.shinkawa.co.jp

Main Product : Shinkawa Electric Co., Ltd. specializes in the manufacturing and distribution of precision instruments, including wire bonding machines, inspection systems, and semiconductor testing equipment.

Company Profile

Shinkawa Electric Co., Ltd. is a leading company in the precision instrument industry, known for its innovative solutions and commitment to customer satisfaction.

F&K Delvotec Bondtechnik

Establishment time : F&K Delvotec Bondtechnik was established in [insert establishment date].

website :

Main Product : F&K Delvotec Bondtechnik specializes in manufacturing [insert main products].

Company Profile

F&K Delvotec Bondtechnik is a leading manufacturer of [insert company introduction].

Nous contacter

Author:

Ms. bella

E-mail:

info@lzjinlida.net

Phone/WhatsApp:

++86 15098602077

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